Thanks Paul....hopefully I will get approval to do SEM so that I can know if its solder splash or surface finish I am dealing with here.

Amol S. Kane
Process Engineer
Harvard Custom Manufacturing, Inc.
941 Route 28
Owego NY 13827
Phone: 607-687-7669 Ext 349
Fax: 607-687-9733
[log in to unmask]<mailto:[log in to unmask]>
www.harvardgrp.com<http://www.harvardgrp.com>

From: Paul Edwards [mailto:[log in to unmask]]
Sent: Friday, July 10, 2009 12:28 PM
To: TechNet E-Mail Forum; Kane, Amol (349)
Subject: RE: Solder Splash at Wave on a AMP socket

Yes it is...Especially if the socket uses fillers in the plastic to meet high-temp or flammability requirements...

Paul

Paul Edwards

Surface Art Engineering


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Kane, Amol (349)
Sent: Friday, July 10, 2009 6:21 AM
To: [log in to unmask]
Subject: [TN] Solder Splash at Wave on a AMP socket

Dear Technetters,
We have an instance of solder splash after wave on a AMP socket (1-822473-5) and the PCB underneath the socket. There are very fine particles of solder (or surface finish, I am going to do a SEM to find out the composition) that are evident visually during inspection after wave. The surface finish on the board is HASL and on the socket is Sn (Base metal is phosphor bronze).

I tried a few sockets by fluxing them and manually holding them over the solder pot. I observed that the solder actually sticks to the plastic portion of the socket if it comes in contact with the socket body. Is that normal?

I will adjust the wave ht to prevent the solder from drawing up the lead so much that it comes in contact with the body as see if this issue goes away

In the mean time, I thought about posting this on Technet to see if anybody else has observed a similar phenomenon before.

Any leads will be greatly appreciated.

Regards,
Amol



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