Lee It's better quality than mine, (not a copy of a copy of a..., you can even see the staple holes from when it was singulated to go through machine!) Looks like a handy place for other stuff too, so thanks. Regards Mike -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Lee Whiteman Sent: 29 July 2009 14:03 To: [log in to unmask] Subject: Re: [TN] FORMULA FOR DETERMINING GOLD PERCENTAGE IN A SOLDER JOINT I found the paper, "Effect of Au on the reliability of fine pitch surface mount solder joints" at this hyperlink: http://www.osti.gov/bridge/servlets/purl/5208317-1FSVKm/5208317.pdf We had a serious problem with Gold (Au) with one of our suppliers, hence my curiosity. Glancing at it, the paper looks pretty interesting. Lee Whiteman, PMP Senior Member Engineering Staff L-3 Communications East Telephone: (856) 338-3508 FAX: (856) 338-2906 E-Mail: [log in to unmask] -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Mike Fenner Sent: Wednesday, July 29, 2009 6:34 AM To: [log in to unmask] Subject: Re: [TN] FORMULA FOR DETERMINING GOLD PERCENTAGE IN A SOLDER JOINT EPP or at least EPP Europe is still in existence http://www.epp-online.de/epp/live/start/1.html However If you Google the words in the title you will find a number of libraries who will sell you a copy of the paper. On my HDD I find I have a copy of a paper "Effect of Au on the reliability of fine pitch surface mount solder joints" By Glazer - Hewlett Packard, Kramer - University of California and Morris - Lawrence Berkeley Laboratory which is pertinent. Finally you can down load an Application Note "Soldering to gold" which deals with this topic at a lower, pragmatic level. http://www.indium.com/techlibrary/applicationnotes.php Regards Mike -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian Sent: 29 July 2009 00:18 To: [log in to unmask] Subject: Re: [TN] FORMULA FOR DETERMINING GOLD PERCENTAGE IN A SOLDER JOINT Jon, You will have to go to a library, probably a tech one or a big one. I have only been able to find sporadic issues from November 2000 to June 2003 on line. Bev RIM -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Gervascio, Thomas L Sent: Tuesday, July 28, 2009 6:42 PM To: [log in to unmask] Subject: Re: [TN] FORMULA FOR DETERMINING GOLD PERCENTAGE IN A SOLDER JOINT How could I get a copy of it? I thought EP&P was out of print.. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman Sent: Tuesday, July 28, 2009 10:01 AM To: [log in to unmask] Subject: Re: [TN] FORMULA FOR DETERMINING GOLD PERCENTAGE IN A SOLDER JOINT Hi Jon - the folks from Lockheed published a very good article on the impact of gold on solder joints including the calculations/material parameters/graphs that would be useful to you. Pull a copy of this article: "Effects of Gold Diffusion on a Near Eutectic Solder Joint", S. Enwright, Electronic Packaging & Production, June 1998, pp 68-72. Good Luck. Dave Hillman Rockwell Collins [log in to unmask] "Roberts, Jon (SA-1)" <[log in to unmask]> Sent by: TechNet <[log in to unmask]> 07/28/2009 07:53 AM Please respond to TechNet E-Mail Forum <[log in to unmask]>; Please respond to "Roberts, Jon (SA-1)" <[log in to unmask]> To [log in to unmask] cc Subject [TN] FORMULA FOR DETERMINING GOLD PERCENTAGE IN A SOLDER JOINT Does anyone have or know where to find the formula for determining the amount of percentage of gold in a SMT solder joint? 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