Thank you, Victor I am gathering that this is not a standard IC device based on your description but a DIP which has the leads shaped in a gull wing format as opposed to straight leads as is the norm. I was under the impression you were using a standard package of which there are several package types which might be covered by your description including: the SOP, the SSOP, the TSOP and the TSSOP both of later can be either TYPE 1 or TYPE 2. (leads on short side vs lead on long side) Lead pitch will also be important and depending on the device lead pitch can be 0.50mm, 0.55mm, 0.60mm, 0.65mm, 0.80mm, 1.0mm and 1.27mm From this list you might be able to identify one which most closely represents your special device and work from there. Good luck with your project, Joe In a message dated 7/21/2009 9:14:17 A.M. Pacific Daylight Time, [log in to unmask] writes: A surface mount dual in line plastic package with leads formed in a gull wing fashion. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Joe Fjelstad Sent: Tuesday, July 21, 2009 10:49 AM To: [log in to unmask] Subject: Re: [TN] Dual In Line Package, 8 pin, lead width versus external copper pad ... Hello Victor There is perhaps a bit of confusion in terms here. Dual In-line Packages (DIP) are generally through hole leaded devices. The term "gull wing" indicates a surface mount device which is what seems to be of interest to you. I would add to Steve's comments that the component suppliers often provide their recommendations as well. Kind regards, Joe In a message dated 7/21/2009 5:28:04 A.M. Pacific Daylight Time, [log in to unmask] writes: I did not receive any input on my initial inquiry. I will resubmit it now. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez Sent: Monday, July 20, 2009 10:57 AM To: [log in to unmask] Subject: [TN] Dual In Line Package, 8 pin, lead width versus external copper pad width Fellow TechNetters: What is IPC guidelines for a DIP gull wing component lead width ratio to external copper pad width on lead free assemblies? Victor, --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- **************What's for dinner tonight? 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