Hi all, Per JEDEC STD MO-269 and MO-224, note 12, Recommended plating for contact pads are: 1) Preferable plating : Electrolytic Gold plating 0.76 micrometers minimum over electrolytic nickel 2.00 micrometers minimum. 2) Alternative plating: Gold plating 0.05-0.75 micrometers over nickel 2.00 micrometers minimum must use an electronic contact grade corrosive barrier lubricant. I have a few questions: 1) "is the alternative Au plating electroless?" Gold flash? 2) What is "an electronic contact grade corrosive barrier lubricant?" Can some provide a specific mateial? 3) Who will be applying this "electronic contact grade corrosive barrier lubricant" onto the bare board? The fab supplier? 4) What percentage of fabs are build with alternative plating today? Thanks all in advance. Ted --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------