HIP - HOP it's all the same to me......8-) John Burke (408) 515 4992 -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier /* Sent: Friday, July 17, 2009 9:19 AM To: [log in to unmask] Subject: Re: [TN] [SMART] Head In Pillow Joints->Head On Pillow 'Head In Pillow' sure is a strange terminology--'Head On Pilow' is by far more descriptive Werner -----Original Message----- From: Mike Fenner <[log in to unmask]> To: [log in to unmask] Sent: Fri, Jul 17, 2009 5:03 am Subject: Re: [TN] [SMART] Head In Pillow Joints Since 2001? Ingenious as ever John, but perhaps it maybe time to look at more modern materials which address this issue without mechanical aids. Regards Mike _____ From: SMART Group smart-e-link [mailto:[log in to unmask]] On Behalf Of John Burke Sent: 16 July 2009 18:51 To: [log in to unmask] Subject: Re: [SMART] Head In Pillow Joints Quite often seen as a field failure since due to the compression of the head in pillow interface it is quite possible to test and get signals through only to find it fails in the field. Data for this defect would be best found from companies using large BGA's say above 20 x 20 mm with smaller BGA pitch - say 0.8mm and below, and taking both their internal records of such failures and mapping it with RMA returns for the same defect. Truth is, this defect actually in many cases results in an RMA return where upon return there is NTF (No trouble found). If you really want to find if you have this condition in your manufacturing process the only way to completely engineer it out is to include a vibration under power and use test during the pilot runs to tune in the reflo w profile. I have used this method since 2001. John John Burke (408) 515 4992 _____ From: SMART Group smart-e-link [mailto:[log in to unmask]] On Behalf Of bob Willis Sent: Thursday, July 16, 2009 9:25 AM To: [log in to unmask] Subject: Re: [SMART] Head In Pillow Joints _____ <http://www.smartgroup.org> SMART logo smart-e-link is an e-mail technical forum organised by the SMART Group. Visit our webpage <http://www.smartgroup.org/smtlink.htm> for subscription information, rules of use and any questions. smart-e-link is sponsored by Soldertec Global <http://www.soldertec.com> - a business providing laboratory testing, troubleshooting, and analytical services to the global electronics industry. Services include x-ray inspection, scanning electron microscopy, solderability testing, SIR and in testing of components and materials for compliance with the RoHS Directive. Visit www.soldertec.com. 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