Hi Pradeep, Did they bake the moisture out of the PCBs prior to wave soldering? Werner -----Original Message----- From: mp3 <[log in to unmask]> To: [log in to unmask] Sent: Tue, Jul 14, 2009 6:50 am Subject: [TN] Solderability Hi, We are a PCB manufacturer and we had supplied some 2.4mm thick PCBs to one of our customers who has complained regarding solderability issue. They say there are having issues with respect to blowholes / pinholes after wavesoldering. We had checked for solderability on the coupon and had ensured that everything is acceptable prior to the despatch. We repeated the same after receipt of the feedback and found the results to be OK. To simulate it, we sent a couple of bare circuits to a 3rd party assembler and got it wave soldered. The hole diameters are 2.55mm and 1.0mm . The photographs after wavesoldering trials are attached. We find it to be quite OK. We feel that since there are no components, and since the diameter is on the higher side, there will be a slight depression at the centre. But the customer insists that the trial boards too have a problem. Can you give a feedback on this after checking the attached photographs. We were asking our customer to check on the parameters like fluxing etc. And he says all are well in control. Any inputs to understand this issue better. rgds pradeep --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- ------------------------------- Micropack Ltd, Bangalore, India --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------