Buck up campers! The best is yet to come.
Some of the packages the component companies are coming out with are
crazy. To incorporate these packages in a manufacturable layout will take
skill, experience, creativity and PEOPLE.
The cycle marches on and I see a lot of
signs that the PCB Layout/Design Proto and NPI cycle is coming off the bottom
of a very protracted trough and that the sharp ramp for technically proficient
people will create a huge talent shortage. There will likely be
pockets of horror for the rest of the summer, but it is always darkest before
the dawn.
What are the most challenging packages you
are seeing?
What do you see coming down the pipe for
near future component packaging challenges?
High pin count .4mm BGA’s are
providing us plenty of challenges in fabrication, assembly and test access,
where are your head aches coming from? (Other than lack of demand).
Joe
From:DesignerCouncil
[mailto:[log in to unmask]] On Behalf Of
Silicon Valley Chapter - IPC
Sent: Tuesday, July 14, 2009 4:08
PM
To: [log in to unmask]
Subject: [DC] Testing
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