Bonjour Sylvain, I have recently done several boards with the exacly same components, in almost the same conditions as yours. I had ENIG/Pick'n'place/lead-free SAC305. The only difference was I did convection reflow. They print well, they solder well. I would not dread shorts, this package is more lenient than QFNs. The only 2 special things I have observed were: - The thermal demand is higher than for regular BGAs. I had metal top BGAs on the same board, still the LGAs were 10 deg C colder. In order to bring the LGAs at 240deg C I had to bump the BGAs up to 250 deg C. - Hard to control voiding Since I am not familiar with vapour phase, maybe the above will not be an issue for you. Regards, Ioan Tempea, ing. t : 450-967-7100 ext : 244 [log in to unmask] www.digico.cc P N'imprimer que si nécessaire - Print only if you must -----Message d'origine----- De : Sylvain Kaufmann [mailto:[log in to unmask]] Envoyé : 19 juin 2009 09:06 À : [log in to unmask] Objet : [TN] LGA assembly question Dear Technetters, Our assembly workshop has to assemble 4 prototype boards where LGA packages with 133 connections are used. I allready worked with BGAs or QFNs but never with LGA packages and I am concerned about shorts/open that could occur. Provided that I cannot run tests and conditions are as followed: - ENIG surface finish boards - Vapor phase reflow soldering - Pick and Place machine - Leadfree or lead containing solder can be used Would some of you be kind enough to share experiences/advices so that we would have little chances to successfuly assemble these boards? Thank you in advance for your help. S. Kaufmann ************************************************************ Sylvain Kaufmann CERN / European laboratory for particle physics Site de Meyrin 1211 Geneva 23 Switzerland Dpt: EN-ICE-DEM (int mail J06600) Phone: +41 22 767 37 02 Fax: +41 22 766 87 77 E-mail: [log in to unmask] Web: www.cern.ch http://cern.ch/dem ************************************************************ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------