Sylvain, Please enlighten us as to your understanding of the differences between a QFN and an LGA. Bev RIM -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Sylvain Kaufmann Sent: Friday, June 19, 2009 9:06 AM To: [log in to unmask] Subject: [TN] LGA assembly question Dear Technetters, Our assembly workshop has to assemble 4 prototype boards where LGA packages with 133 connections are used. I allready worked with BGAs or QFNs but never with LGA packages and I am concerned about shorts/open that could occur. Provided that I cannot run tests and conditions are as followed: - ENIG surface finish boards - Vapor phase reflow soldering - Pick and Place machine - Leadfree or lead containing solder can be used Would some of you be kind enough to share experiences/advices so that we would have little chances to successfuly assemble these boards? Thank you in advance for your help. S. Kaufmann ************************************************************ Sylvain Kaufmann CERN / European laboratory for particle physics Site de Meyrin 1211 Geneva 23 Switzerland Dpt: EN-ICE-DEM (int mail J06600) Phone: +41 22 767 37 02 Fax: +41 22 766 87 77 E-mail: [log in to unmask] Web: www.cern.ch http://cern.ch/dem ************************************************************ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------------------------- This transmission (including any attachments) may contain confidential information, privileged material (including material protected by the solicitor-client or other applicable privileges), or constitute non-public information. Any use of this information by anyone other than the intended recipient is prohibited. If you have received this transmission in error, please immediately reply to the sender and delete this information from your system. Use, dissemination, distribution, or reproduction of this transmission by unintended recipients is not authorized and may be unlawful. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------