Dear Technetters, Our assembly workshop has to assemble 4 prototype boards where LGA packages with 133 connections are used. I allready worked with BGAs or QFNs but never with LGA packages and I am concerned about shorts/open that could occur. Provided that I cannot run tests and conditions are as followed: - ENIG surface finish boards - Vapor phase reflow soldering - Pick and Place machine - Leadfree or lead containing solder can be used Would some of you be kind enough to share experiences/advices so that we would have little chances to successfuly assemble these boards? Thank you in advance for your help. S. Kaufmann ************************************************************ Sylvain Kaufmann CERN / European laboratory for particle physics Site de Meyrin 1211 Geneva 23 Switzerland Dpt: EN-ICE-DEM (int mail J06600) Phone: +41 22 767 37 02 Fax: +41 22 766 87 77 E-mail: [log in to unmask] Web: www.cern.ch http://cern.ch/dem ************************************************************ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------