I have obtained repeatable results by using Al tape to stick the thermocouple to the board and using Kapton tape over it to maintain adhesion at high temps. Regards, Amol -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Braddock, Iain (UK) Sent: Wednesday, June 10, 2009 5:34 AM To: [log in to unmask] Subject: [TN] Profiling compound? Hi all, What is the preferred medium for bonding thermocouples to boards for PbFree thermal profiling - forced convection! CIA, Iain ******************************************************************** This email and any attachments are confidential to the intended recipient and may also be privileged. If you are not the intended recipient please delete it from your system and notify the sender. You should not copy it or use it for any purpose nor disclose or distribute its contents to any other person. MBDA UK Limited, a company registered in England and Wales, registration number 3144919 whose registered office is at Six Hills Way, Stevenage, Hertfordshire, SG1 2DA, England. ******************************************************************** ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please visit http://www.messagelabs.com/email ______________________________________________________________________ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- WARNING: Export Control This document may contain technical data within the definition of the International Traffic in Arms Regulations (ITAR), and subject to the Export Control Laws of the U.S. Government. Transfer of such data by any means to a foreign person, whether in the United States or abroad, without proper export authorization or other approval from the U.S. Department of State is prohibited. CONFIDENTIALITY NOTICE: This e-mail, and any attachments, is for the sole use of the intended recipient(s) and may contain information that is confidential and protected from disclosure under the law. Any unauthorized review, use, disclosure, or distribution is prohibited. If you are not the intended recipient, please contact the sender by reply e-mail, and delete/destroy all copies of the original message and attachments. Thank you. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------