Hi Iain, we always use high melting point solder (88Pb10Sn2Ag usually) Regards Ian Fox Lead Materials and Process Engineer Aero Engine Controls A Rolls-Royce plc and Goodrich Corporation Joint Venture -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Braddock, Iain (UK) Sent: 10 June 2009 10:34 To: [log in to unmask] Subject: [TN] Profiling compound? Hi all, What is the preferred medium for bonding thermocouples to boards for PbFree thermal profiling - forced convection! CIA, Iain ******************************************************************** This email and any attachments are confidential to the intended recipient and may also be privileged. If you are not the intended recipient please delete it from your system and notify the sender. You should not copy it or use it for any purpose nor disclose or distribute its contents to any other person. MBDA UK Limited, a company registered in England and Wales, registration number 3144919 whose registered office is at Six Hills Way, Stevenage, Hertfordshire, SG1 2DA, England. ******************************************************************** ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please visit http://www.messagelabs.com/email ______________________________________________________________________ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- -------------------------------------------------------------------------- This message (and any attachment) is confidential and is intended for the named recipient only. If you receive it in error please e-mail back the sender and permanently delete the original message and any copies. Rolls-Royce Goodrich Engine Control Systems Limited. Registered Office: Moor Lane, PO Box 31, Derby, DE24 8BJ. Registered in England No. 06686268. -------------------------------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------