Embedment is the consummate conclusion of two potted individuals in an encapsulating environment. Dewey -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Lee Whiteman Sent: Thursday, June 04, 2009 12:10 PM To: [log in to unmask] Subject: Re: [TN] Coating, Encapsulation, and Potting Doug, My shot at this... 1. What would you consider to be a definition of "potting" and a definition of "encapsulation"? According to Webster's, a device is encapsulated when it is "surrounded by a gelatinous or membranous envelop." Based on this definition, I would consider potting and encapsulation to be the same. 2. Are there standard definitions for these somewhere? They don't exist in IPC as far as I know. I'm not aware of any. You're entering new territory kid. 3. What would you consider to be the boundary between conformal coating and "potting or encapsulation"? I have my own opinions but want to hear yours. Conformal coat is a 3 - 5 mil finish on a circuit card. The device is not fully submerged. Potting or Encapsulation fully submerges the device in a material. 4. In what class would you consider an underfill to be in? I would consider it a separate class from encapsulated materials and conformal coating. Hope this helps. Good Luck Lee Whiteman, PMP Senior Member Engineering Staff L-3 Communications East Telephone: (856) 338-3508 FAX: (856) 338-2906 E-Mail: [log in to unmask] -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Douglas Pauls Sent: Thursday, June 04, 2009 2:32 PM To: [log in to unmask] Subject: [TN] Coating, Encapsulation, and Potting Good afternoon all, All this talk of underfill sparked a reminder of an IPC action item of mine. Unknownst to most of you , I signed you all up on some of my committees. There will be a new task group addressing potting and encapsulation, which will meet at the Fall IPC. We already have conformal coat task groups. So, I wish to initiate a series of questions and illuminating debate. Pardon me if I fall short on the illumination part (leave it alone Dewey). 1. What would you consider to be a definition of "potting" and a definition of "encapsulation"? 2. Are there standard definitions for these somewhere? They don't exist in IPC as far as I know. 3. What would you consider to be the boundary between conformal coating and "potting or encapsulation"? I have my own opinions but want to hear yours. 4. In what class would you consider an underfill to be in? That's enough homework for now. Doug Pauls Rockwell Collins --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------