Hi Techies As a follow-up to Richard's question, you might note that I have presented a "Solder Paste Process Test" that is a modified version of the 5 IPC-TM-650 methods examining: Slump, Solder Balling, Spreading, Tack and Wetting plus a new "Open Time" method. These can all be run within an hour to verify the paste is fit for use. The original document is a SMART Standard that is now in with IPC Committee for consideration. If anyone wants some more information, let me know directly. Regards Graham Naisbitt Email: [log in to unmask] Phone: +44 (0)12 5252 1500 Web: www.gen3systems.com On 24 Jun 2009, at 15:22, Stadem, Richard D. wrote: > I would like to know what others do to ensure that the solder paste is > good at the point of use. > > I am NOT looking for a solder paste handling procedure, what I am > looking for is what type of test can be performed that is quick, easy, > and does not hold up production. We do paste viscosity testing on each > lot that we receive, and we also strictly monitor our paste printing > process with the post-print inspection machine. We have validated our > entire solder paste handling system to ensure that the paste is > handled, > labeled, and properly rotated. > > We have had no issues with the solder paste that we use. > > Our customer thinks we should test each lot of paste when it is > removed > from refrigeration prior to use on production hardware. I am not > really > sure what a second viscosity check would do for us, but I am open to > some other testing method that does not consume a lot of paste and > would > provide data we can use. > > Any suggestions? > > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 15.0 > To unsubscribe, send a message to [log in to unmask] with following > text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask] > : SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask] > : SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 > for additional information, or contact Keach Sasamori at [log in to unmask] > or 847-615-7100 ext.2815 > ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------