Hi TechNet, OK I'll admit it, I'm fairly new to the field of solder joint reliability. ;) Therefore, the recent thread about underfill inspection criteria prompted me to do additional reading on the subject. It seems like there is consensus on the positive effect of underfilling on BGA solder joint reliability. On the other hand, are there cases where underfill doesn't have a significant impact? Maybe in smaller BGA components? Thanks, Ed Rios --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------