Hi TechNet,

OK I'll admit it, I'm fairly new to the field of solder joint 
reliability. ;)  Therefore, the recent thread about underfill inspection 
criteria prompted me to do additional reading on the subject. It seems 
like there is consensus on the positive effect of underfilling on BGA 
solder joint reliability. On the other hand, are there cases where 
underfill doesn't have a significant impact? Maybe in smaller BGA 
components?

Thanks,

Ed Rios

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