No. You are not getting old. I forget entire IPC documents all the time, no way anybody can remember them all. I guess that is why we have the forum, so we can point each other to what we are looking for on a daily basis. There are no hard and fast requirements. As Werner pointed out, there cannot be. But there certainly is some good guidelines, and some good information to help us optimize the processes. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian Sent: Tuesday, May 19, 2009 3:56 PM To: [log in to unmask] Subject: Re: [TN] Underfill Pass/fail criteria Richard, Thank you. I'm getting old. I had read 7095 cover to cover in the past, but do you think I could remember there was anything in it about underfill?! Unfortunately 7.2.2.1, page 82, line 5 says it all. "There is no industry standard for allowable voids in underfill." After some tweaking, I will share what I have written as a draft for this issue, but I doubt I will be able to do so before Friday afternoon, as I will be spending most of the remaining portion of the week at the International Conference on Soldering and Reliability in Toronto (some last minute advertising there). Bev RIM -----Original Message----- From: Stadem, Richard D. [mailto:[log in to unmask]] Sent: Tuesday, May 19, 2009 4:01 PM To: [log in to unmask]; Bev Christian Subject: RE: [TN] Underfill Pass/fail criteria Ok, Bev. Here goes. IPC-7095 has very good examples of acceptable underfill for BGAs, including good, bad, and ugly pictures of insufficient, excess, voided, etc., underfill. It is all listed in Section 7.2.2. Also included is very good instructions on interpretation of Scanning Acoustic Imaging examples, and the use of C-SAM thereof. IPC-7094 has ditto for Flipchips and CSPs. Either of these fine documents are available for sale from your nearest IPC supermarket. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian Sent: Tuesday, May 19, 2009 12:52 PM To: [log in to unmask] Subject: [TN] Underfill Pass/fail criteria TechNetters, I am aware of J-STd-030 "Guideline for Selection & Application of Underfill" and the existence of IPC standards committee 5-24F "Underfill Adhesives for Flip Chip Applications". There is nothing in IPC-A-610D about underfills. I have taken Brian Toleno's very good course on underfills, but on going back and looking at the CD, I don't see anything on pass/fail criteria. Do any of you know of an international standard (American, IEC, Japanese) with pass/fail criteria for cured underfills? I am particularly interested in what said standard (or anything you want to tell me) says about coverage and voiding. Bev RIM --------------------------------------------------------------------- This transmission (including any attachments) may contain confidential information, privileged material (including material protected by the solicitor-client or other applicable privileges), or constitute non-public information. Any use of this information by anyone other than the intended recipient is prohibited. If you have received this transmission in error, please immediately reply to the sender and delete this information from your system. Use, dissemination, distribution, or reproduction of this transmission by unintended recipients is not authorized and may be unlawful. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------------------------- This transmission (including any attachments) may contain confidential information, privileged material (including material protected by the solicitor-client or other applicable privileges), or constitute non-public information. Any use of this information by anyone other than the intended recipient is prohibited. If you have received this transmission in error, please immediately reply to the sender and delete this information from your system. Use, dissemination, distribution, or reproduction of this transmission by unintended recipients is not authorized and may be unlawful. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------