Bev, You missed the biggest disadvantage—it is destructive. I would think the completeness of underfill coverage depends at least to some degree on the degree of the quality of the flux removal process underneath the component. Thus, I would think you will find something different with each component. Having a destructive method may give you 100% scrap, 8-( Werner -----Original Message----- From: Bev Christian <[log in to unmask]> To: [log in to unmask] Sent: Tue, 19 May 2009 2:54 pm Subject: Re: [TN] Underfill Pass/fail criteria Ioan, Well if you don't have any expletive deleted RF cans in the way, you can use acoustic microscopy. Otherwise your choices are: 1) Prying 2) Vertical cross-sectioning 3) Horizontal cross-sectioning Here blow are my perceived advantages and disadvantages of each. I pasted the table in as HTML. Hope this shows up in TechNet! Method Advantages Disadvantages Prying Fast, easy, can be done by anyone, checks whole area under component at once Misses embedded voids that don't reach the underfill/component interface Vertical Cross-sectioning Finds buried voids Requires lab staff, only finds voids in the particular plane sectioned, unless grind further (very time consuming) Horizontal cross-sectioning Finds buried voids, checks whole area under component Requires lab staff, very time consuming Bev RIM -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Ioan Tempea Sent: Tuesday,20May 19, 2009 2:40 PM To: [log in to unmask] Subject: Re: [TN] Underfill Pass/fail criteria Bev, No answer here, but one question: how can one visualize and measure voiding in underfills? Thanks, Ioan Tempea, ing. t : 450-967-7100 ext : 244 [log in to unmask] www.digico.cc P N'imprimer que si nécessaire - Print only if you must -----Message d'origine----- De : Bev Christian [mailto:[log in to unmask]] Envoyé : 19 mai 2009 13:52 À : [log in to unmask] Objet : [TN] Underfill Pass/fail criteria TechNetters, I am aware of J-STd-030 "Guideline for Selection & Application of Underfill" and the existence of IPC standards committee 5-24F "Underfill Adhesives for Flip Chip Applications". There is nothing in IPC-A-610D about underfills. I have taken Brian Toleno's very good course on underfills, but on going back and looking at the CD, I don't see anything on pass/fail criteria. Do any of you know of an international standard (American, IEC, Japanese) with pass/fail criteria for cured underfills? I am particularly interested in what said standard (or anything you want to tell me) says about coverage and voiding. 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