Steve, I'll send a snapshot on my cat in a few minutes, to show you how interested she was....I feel utterly insulted.. Inge ----- Original Message ----- From: "Inge" <[log in to unmask]> To: "TechNet E-Mail Forum" <[log in to unmask]>; "Steve Gregory" <[log in to unmask]> Sent: Friday, May 29, 2009 5:39 PM Subject: Re: [TN] Looking for opinions on separation/delamination between copper land and dielectric material. > Steve, do you recommend this if the cat is a Maine Coon ? > I showed the tube to my cat, but she just jawned and looked bored. > Apparently, this was beyond her dignity. I tried to yoddle myself, but she > looked down with pain and trotted away. > Inge > > > ----- Original Message ----- > From: "Steve Gregory" <[log in to unmask]> > To: <[log in to unmask]> > Sent: Friday, May 29, 2009 4:57 PM > Subject: Re: [TN] Looking for opinions on separation/delamination between > copper land and dielectric material. > > > Okay Inge, here's some light entertainment. > > As engineers, I know many of you have struggled with the complex > problems of trying to teach your cats how to yodel. > > So, thanks to the wonderful technology of the internet and two engineers > named Paul and TJ, here is a short video called: "An Engineers Guide to > Cat Yodeling" which hopefully solve your dilemma: > > http://www.youtube.com/watch?v=aEjKk5Kt3rs&feature=channel > > Enjoy B^) > > Steve > > --------------------------------- > On May 29, 2009 Inge wrote: > > Looking forward to the TN Friday light entertainments....have nothing > myself at the moment > > Inge > > > > > > > ----- Original Message ----- > From: "Werner Engelmaier /*" <[log in to unmask]> > To: <[log in to unmask]> > Sent: Friday, May 29, 2009 2:43 PM > Subject: Re: [TN] Looking for opinions on separation/delamination > between copper land and dielectric material. > > >> Ni hao charming, >> That separation can occur during cooling from solder reflow [if too >> fast=thermal shock] or in your T-shock test [would have been good to >> give details. >> Your TSSOP leads are likely Alloy42 [=very stiff] and are very stubby >> [=very stiff] with SAC-solder [=very stiff]. >> In T-shock it is NOT any CTE-mismatch that causes your problem [even >> though it does not help, and may cause reliability problems with the >> product], but the thermal gradients resulting from T-shock and causing > >> component/PCB warpage. >> >> How to improve on that? EASY, do not do T-shock in production [slow >> cooling rate after reflow to 1.5C/sec or less] and in testing go less >> severe or no T-shock at all. >> >> Werner >> >> >> >> >> >> >> >> >> >> -----Original Message----- >> From: Charming Chan <[log in to unmask]> >> To: [log in to unmask] >> Sent: Fri, 29 May 2009 4:45 am >> Subject: [TN] Looking for opinions on separation/delamination between >> copper land and dielectric material. >> >> >> >> >> >> >> >> >> >> >> Hello All, >> >> Our guys ran a thermal shock test to verify solder joint reliability >> of a TSSOP component. The micro-section shows that there is a minor >> crack at the toe side of the solder joint and a >> separation(delamination) between the copper land and the dielectric >> material. >> >> My question is, >> >> Where did the separation/delamination occur? PCB fab house, PCB >> assembly house, or thermal shock test? >> >> If the separation/delamination occurred at pcb fab house, then, what's > >> the possible root cause gonna be? >> >> If the separation/delamination occurred at thermal shock test or pcb >> assembly house, then, is it caused by CTE mismatch between pcb base >> material, solder alloy, and gull-wing footprint? How to improve on > that? >> >> Brain storm, and any input is appreciated. >> I will get the micro-section picture posted once I get it. Thank you > all. >> >> Best Regards >> Charming Chan >> >> --------------------------------------------------- >> Technet Mail List provided as a service by IPC using LISTSERV 15.0 To >> unsubscribe, send a message to [log in to unmask] with following text in > >> the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt >> or (re-start) delivery of Technet send e-mail to >> [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing >> per day of all the posts: send e-mail to >> [log in to unmask]: SET Technet Digest >> Search the archives of previous posts at: >> http://listserv.ipc.org/archives Please visit IPC web site >> http://www.ipc.org/contentpage.asp?Pageid=4.3.16 >> for >> additional information, or contact Keach Sasamori at [log in to unmask] or > >> 847-615-7100 ext.2815 >> ----------------------------------------------------- >> >> >> >> >> >> >> --------------------------------------------------- >> Technet Mail List provided as a service by IPC using LISTSERV 15.0 To >> unsubscribe, send a message to [log in to unmask] with following text in > >> the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt >> or (re-start) delivery of Technet send e-mail to >> [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing >> per day of all the posts: send e-mail to >> [log in to unmask]: SET Technet Digest >> Search the archives of previous posts at: >> http://listserv.ipc.org/archives Please visit IPC web site >> http://www.ipc.org/contentpage.asp?Pageid=4.3.16 >> for additional information, or contact Keach Sasamori at >> [log in to unmask] or 847-615-7100 ext.2815 >> ----------------------------------------------------- > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 15.0 To > unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or > (re-start) delivery of Technet send e-mail to [log in to unmask]: SET > Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the > posts: send e-mail to [log in to unmask]: SET Technet Digest Search the > archives of previous posts at: http://listserv.ipc.org/archives Please > visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for > additional information, or contact Keach Sasamori at [log in to unmask] or > 847-615-7100 ext.2815 > ----------------------------------------------------- > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 15.0 > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 > for additional information, or contact Keach Sasamori at [log in to unmask] or > 847-615-7100 ext.2815 > ----------------------------------------------------- > --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------