Working in South Africa at the moment but I did produce a standard or some guidelines some years back for Speedline Workshop. I will circulate a link when I get back to my office providing I can still find it. I always wanted to do this and produce a set of images to go with my underfill workshop. Send the link to all when I get away from the sharks!! Bob Willis 2 Fourth Ave, Chelmsford, Essex, CM1 4HA England Tel: (44) 1245 351502 Fax: (44) 1245 496123 Mobile: 07860 775858 www.ASKbobwillis.com PCB Design for Manufacture & Assembly Workshop 15th October www.ASKbobwillis.com PCB Inspection & Quality Control Workshop 3rd November www.ASKbobwillis.com/faworkshops.pdf Book Bob's "Step by Step Failure Analysis Workshop" 4th November www.ASKbobwillis.com/faworkshops.pdf -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian Sent: 19 May 2009 18:52 To: [log in to unmask] Subject: [TN] Underfill Pass/fail criteria TechNetters, I am aware of J-STd-030 "Guideline for Selection & Application of Underfill" and the existence of IPC standards committee 5-24F "Underfill Adhesives for Flip Chip Applications". There is nothing in IPC-A-610D about underfills. I have taken Brian Toleno's very good course on underfills, but on going back and looking at the CD, I don't see anything on pass/fail criteria. Do any of you know of an international standard (American, IEC, Japanese) with pass/fail criteria for cured underfills? I am particularly interested in what said standard (or anything you want to tell me) says about coverage and voiding. Bev RIM --------------------------------------------------------------------- This transmission (including any attachments) may contain confidential information, privileged material (including material protected by the solicitor-client or other applicable privileges), or constitute non-public information. Any use of this information by anyone other than the intended recipient is prohibited. If you have received this transmission in error, please immediately reply to the sender and delete this information from your system. Use, dissemination, distribution, or reproduction of this transmission by unintended recipients is not authorized and may be unlawful. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------