焊盘的实际尺寸是900mm*1000mm
 
丝网开孔方式采取防锡珠处理,且长宽各缩10%
 
 

Best Regards 
屈小红(Qu Xiaohong) 
Alcatel Shanghai Bell Co,Ltd 
*: 50554550-7771 
*: [log in to unmask] <mailto:[log in to unmask]>  

 

________________________________

From: HouToby [mailto:[log in to unmask]] 
Sent: 2009年4月10日 22:20
To: [log in to unmask]; QU Xiaohong
Subject: RE: [TGAsia] 答复: [TGAsia] chip-0603 锡 珠不 良



 可否提供具体的开口尺寸?

________________________________

Date: Fri, 10 Apr 2009 09:02:18 +0800
From: [log in to unmask]
Subject: Re: [TGAsia] 答复: [TGAsia] chip-0603 锡 珠不 良
To: [log in to unmask]


把网板开孔改为防锡珠的凹型,效果应该比较明显。
 
Best Regards 
屈小红(Qu Xiaohong) 
Alcatel Shanghai Bell Co,Ltd 
*: 50554550-7771 
*: [log in to unmask] <mailto:[log in to unmask]> < /SPAN> 

 

________________________________

From: TGAsia [mailto:[log in to unmask]] On Behalf Of Cony Su
Sent: 2009年4月9日 17:12
To: [log in to unmask]
Subject: Re: [TGAsia] 答复: [TGAsia] chip-0603 锡 珠不 良


试试下列方法看看有效果没 
 
 1 .橡皮擦拭PCB 焊盘
 2.减少锡膏量
 3.更换锡膏
 4.预热加快 
   5 .更换不同batch的电容 



HouToby <[log in to unmask]> 
Sent by: TGAsia <[log in to unmask]> 

2009-04-08 21:23 

Please respond to
Asia Committe Task Group Forum <[log in to unmask]>; Please respond to
HouToby <[log in to unmask]>


To

[log in to unmask] 

cc

 

Subject

[TGAsia] chip-0603锡 珠不良

 

 

 




Dear all:
最近遇到了个很棘手的问题,现在公司有一个产品,每次生产,板子上0603chip零件体侧有锡珠产生,位置很不固定.偶尔这个位置,偶尔另外一个位置,最大的直径有0.2-0.3mm,最小的只有0.08mm. 现在试过很多解决方案,减少置件压力,调整温度曲线,缩小钢板开孔面积(现只有84%),板子也烘烤过, 锡膏在其他的产品也使用,但是未发现.现有的PCB 板是镀金板. 各位还有什么好的解决办法?

另外对于锡珠的标准问题,现有的IPC-A-610D 定义不违反最小电气间隙,还是否有其他的标准,目前我们板子上最小间距零件为0.5mm 



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