The correct name of the (vintage) machine is Sebastian stud tester. It's probably followed by a number of more modern ones. From Dage, for instance. Inge ----- Original Message ----- From: "Inge" <[log in to unmask]> To: <[log in to unmask]> Sent: Thursday, April 09, 2009 6:01 PM Subject: Re: [TN] Friday Theorizing > Bob, > > why so thin Tin? And no barrier? What's the purpose? And what do you mean > with a 'carrier' ? > When testing conductor adhesion, we simple make a board sample with a > number of copper traces, then cut it so we get a large number of square > pieces approx. 1x1 inch. Next, we apply a solder paste dot on the center > of each square, size about 2 mm. This is followed by soldering kind of > needles with a round plate to each square sample. Vapour phase or oven > soldered. Finally, the samples are placed in a Sebastian pulling machine's > chuck and depress 'pull'. The machine increases the pull force until the > plate headed needle separates from the FR4 matrix and the value is > presented on the display. Years ago, we did this test frequently on board > coupons, but there is little interest in doing it today, because adhesion > problems are very rare. > > Inge > > > ----- Original Message ----- > From: "bob wettermann" <[log in to unmask]> > To: <[log in to unmask]> > Sent: Thursday, April 09, 2009 5:17 PM > Subject: [TN] Friday Theorizing > > >> Dear Technetters: >> >> Has anyone done any adhesion testing of a 2um tin-electrocoated surface >> (copper carrier) to FR-4? How about a 0.100um tin electrocoated surface? >> Can someone theorize on which might give better adhesion using a 2-part >> epoxy? >> >> Regards >> >> Bob Wettermann >> BEST >> PH 847-767-5745 >> >> --------------------------------------------------- >> Technet Mail List provided as a service by IPC using LISTSERV 15.0 >> To unsubscribe, send a message to [log in to unmask] with following text in >> the BODY (NOT the subject field): SIGNOFF Technet >> To temporarily halt or (re-start) delivery of Technet send e-mail to >> [log in to unmask]: SET Technet NOMAIL or (MAIL) >> To receive ONE mailing per day of all the posts: send e-mail to >> [log in to unmask]: SET Technet Digest >> Search the archives of previous posts at: >> http://listserv.ipc.org/archives >> Please visit IPC web site >> http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional >> information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 >> ext.2815 >> ----------------------------------------------------- > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 15.0 > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 > for additional information, or contact Keach Sasamori at [log in to unmask] or > 847-615-7100 ext.2815 > ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------