ENEPIG offers a lot of advantages , but is not without limitations. The deposition of the Pd is electroless leaving no chance for any nickel corrosion. It is a great contacting surface and is both gold wire bondable for Au and Al wire, depending on the Pd and the Au thickness deposited. The presence of Pd in solder joint is a source of weakness if the soldering material is eutectic solder. However if the solder is LF SAC type alloy the solder joint is extremely robust and of very high reliability. The presence of the Cu in the alloy is integral to joint strength. I guess if aerospace is still in the realm of eutectic solder, ENEPIG would not be the first choice, ENIG would be a better choice. Regards George Milad George Milad National Accounts Manager for Technology Uyemura International Corp (UIC) 249 Town Line Rd Southington CT 06489 [log in to unmask] Cell: (516) 901 3874 **************A Good Credit Score is 700 or Above. See yours in just 2 easy steps!(http://pr.atwola.com/promoclk/100126575x1220814855x1201410739/aol?red ir=http://www.freecreditreport.com/pm/default.aspx?sc=668072&hmpgID=62&bcd=A prilfooter426NO62) --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------