Where in IPC does it specify when a via connected to a plane must 
have thermal relief as opposed to direct connect?

I would think it would have more to do with the assembly process than 
the fabrication process.  For instance - wave, dip or drag soldering.

You input is appreciated.

Thanks,

:-) Dee Stover  [log in to unmask]    x8489
Tech Associate II
National Optical Astronomy Observatories
www.noao.edu 

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