Where in IPC does it specify when a via connected to a plane must have thermal relief as opposed to direct connect? I would think it would have more to do with the assembly process than the fabrication process. For instance - wave, dip or drag soldering. You input is appreciated. Thanks, :-) Dee Stover [log in to unmask] x8489 Tech Associate II National Optical Astronomy Observatories www.noao.edu --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------