Hi Geok. I checked further and found another thread in my archived files that I should have mentioned earlier that further discusses LNA installation, AN116. AN116 is actually a video that is very informative. All of LT's reliability testing was done with a maximum void percentage of 30% so they recommend that the void area be less than 30%. Since IPC-A-610 is silent on this, I have been using <30%, which we are typically well below. Best Regards, -Joe "This e-mail and any attachments are solely for the use of the addressee and may contain L-3 proprietary information that may also be defined as U.S. Government export controlled technical data. If you are an unintended recipient of this e-mail, use, disclosure or distribution of its content is prohibited. Please notify the sender by return e-mail and immediately delete this message." From: Tan Geok Ang [mailto:[log in to unmask]] Sent: Monday, March 23, 2009 6:02 PM To: Macko, Joe @ IEC; TechNet E-Mail Forum Subject: RE: [TN] LGA acceptance Hi Joe, Thank you. I did come across this guide and even have one of their pictures which showed void (not X-ray) but they do not indicate what the acceptance percentage of the void is. We are able to achieve less than 25% of void while one of ours overseas supplier claims that there is not guideline from IPC 610 which we stated as the reference to follow during the procurement. Regards Geok Ang -----Original Message----- From: [log in to unmask] [mailto:[log in to unmask]] Sent: Tuesday, 24 March 2009 12:02 AM To: TechNet E-Mail Forum; Tan Geok Ang Subject: RE: [TN] LGA acceptance Good morning Tan, I ran into the same problem a while back but found an excellent source of process info on the component manufacturer's website. Check out Linear Technology's Application Note 100, "Recommended Land Pattern Design, Assembly and Rework Guidelines For DC/DC uModule in LNA Package" document. It is the best source of LNA type process and accept-reject info that I have found readily available. Sorry but I do not have a link to their website. Good luck Best Regards, -Joe "This e-mail and any attachments are solely for the use of the addressee and may contain L-3 proprietary information that may also be defined as U.S. Government export controlled technical data. If you are an unintended recipient of this e-mail, use, disclosure or distribution of its content is prohibited. Please notify the sender by return e-mail and immediately delete this message." From: TechNet [mailto:[log in to unmask]] On Behalf Of Tan Geok Ang Sent: Friday, March 20, 2009 4:00 AM To: [log in to unmask] Subject: [TN] LGA acceptance Hi All, base on IPC-A-610D, there is no explicit requirement for LGA, all it says about Surface Mount Area Array is "for devices with solder balls that collapse during reflow". Is there any IPC standard/specification define the void on LGA? Thank you all and have a nice day! --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- -----Original Message----- -----Original Message----- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------