Design and Assembly Process Implementation
for Flip Chip and Die Size Components
Implementing flip chip technology in a direct chip attach
(DCA) assembly presents some unique challenges for design, assembly, inspection
and repair personnel. IPC-7094 delivers useful and practical information to
anyone who is currently using or contemplating developing products that employ
the very complex and high density methods needed for the flip chip technology.
The concepts have become especially important due to the pressures to
manufacture products that have components very closely integrated or are
intended for portable and hand held applications. The major emphasis of the new
standard is to provide information to those companies transitioning to this
miniaturization technology with emphasis on system level issues, flip chip and
die size assembly, and the requirements for board and module level reliability.
In addition to providing guidelines for flip chip inspection,
IPC-7094 also addresses the design of the initial element and how the die can
be evaluated during its development process with a goal toward simplification
of the final assembly. Items that are discussed include outsourcing
manufacturing and the procurement of known good die in order to optimize the
return on investment when developing products that use flip chip technology. 75
pages. Released February 2009. Included in the C-1000 Collection
Hard copy:
IPC Member Price $52.00
Nonmember Price $103.00
IPC/JEDEC Mechanical Shock Test Guidelines
for Solder Joint Reliability
Establishes mechanical drop and shock and test guidelines
for assessing solder joint reliability of printed board assemblies from system
to component level. This document addresses methods to define mechanical shock
use-conditions, methods to define system level, system printed board level and
component test board level testing that correlate to such use conditions and
guidance on the use of experimental metrologies for mechanical shock tests. 42
pages. Released March 2009. Included in the C-103 and C-1000 Collections.
Hard copy:
IPC Member Price $36.00
Nonmember Price $72.00
Electronic formats can be found through the links above.
IPC members may request a free single user
download with digital rights management of each new standard by e-mailing [log in to unmask] within
90 days. Please note that you will receive the file from an e-mail from IHS.com.
The file will be LOCKED to the computer of the person who OPENS the file.
Kimberly Sterling, CAE
Vice President, Marketing and Communications
IPC — Association Connecting
Electronics Industries
+1 847-597-2805 tel
+1 847-615-5605 fax
www.ipc.org