Can you share the photos of the cross section? -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Wenger, George M. Sent: Wednesday, February 11, 2009 12:51 PM To: [log in to unmask] Subject: Re: [TN] CRACKED ENIG PADS Lee, When you say "Evidently" that you have done cro Lee, When you say "Evidently" that you have done cross sectioning and see that the cracks are only in the Ni and Au and not in the Cu? Since you said "There was no evidence of a lack of bonding between the copper and the ENIG finish" that implies to me that you did cross section but since I wasn't sure I thought I'd ask. Regards, George George M. Wenger Andrew Wireless Solutions Senior Principal FMA/Reliability Engineer 40 Technology Drive, Warren, NJ 07059 (908) 546-4531 (Office) (732) 309-8964 (cell) [log in to unmask] -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory Sent: Wednesday, February 11, 2009 1:42 PM To: [log in to unmask] Subject: Re: [TN] CRACKED ENIG PADS Hi Lee! Have your pictures posted. They are here: http://stevezeva.homestead.com/files/THROUGH_HOLE_CRACKS-1.jpg http://stevezeva.homestead.com/files/THROUGH_HOLE_CRACKS-2.jpg I have to let those that know more about plating than I do answer this one... Steve -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Lee Whiteman Sent: Wednesday, February 11, 2009 12:20 PM To: [log in to unmask] Subject: [TN] CRACKED ENIG PADS I have asked Steve to put up a pair of pictures I received. They are of cracks within the ENIG finish of a PWB. I know that the board failed, based on IPC-6011 and IPC-6012. My question is what would cause the cracking? Evidently, it is in the Nickel layer and the copper layer was not compromised. There was no evidence of a lack of bonding between the copper and the ENIG finish. These boards are fresh from the supplier. Just curious... Thanks in advance. Lee Whiteman, PMP Senior Member Engineering Staff L-3 Communications East Telephone: (856) 338-3508 FAX: (856) 338-2906 E-Mail: [log in to unmask] --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- ------------------------------------------------------------------------ ------------------------ This message is for the designated recipient only and may contain privileged, proprietary, or otherwise private information. 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