Good morning All, JEDEC Standard JESD22-A113 defines the Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing and calls out a required temp/humidity soak per step 3.1.5 (Table 1) prior to reflow per step 3.1.6 (Table 2). Is the intent of this "temp/humidity soak" based on a component's MSL level to precondition the part so it is at the "end" of its MSL Floor-Life, which would be its worst case condition in terms of moisture sensitivity before subjecting it to the next preconditioning step, 3 reflow cycles? thx Best Regards, -Joe "This e-mail and any attachments are solely for the use of the addressee and may contain L-3 proprietary information that may also be defined as U.S. Government export controlled technical data. If you are an unintended recipient of this e-mail, use, disclosure or distribution of its content is prohibited. Please notify the sender by return e-mail and immediately delete this message." --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------