Hi Mark, this is not 'Black Pad.' Werner -----Original Message----- From: Woolley, Mark D. (Mark) <[log in to unmask]> To: TechNet E-Mail Forum <[log in to unmask]>; Werner engelmaier <[log in to unmask]> Sent: Wed, 11 Feb 2009 3:56 pm Subject: RE: [TN] CRACKED ENIG PADS Werner, These would be very big grains in the nickel. Is this possible that this is the infamous "Black Pad" issue in profile? mark mark Mark Woolley |PTRL Laboratory | Avaya | 1300 West 120th Ave | Westminster, CO 80234 Voice (Lab): (303) 538-2166 -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner engelmaier Sent: Wednesday, February 11, 2009 1:52 PM To: [log in to unmask] Subject: Re: [TN] CRACKED ENIG PADS Well, these are cracks alright. Werner -----Original Message----- From: Steve Gregory <[log in to unmask]> To: [log in to unmask] Sent: Wed, 11 Feb 2009 3:46 pm Subject: Re: [TN] CRACKED ENIG PADS Hi again Lee! Got it! Here it is: http://stevezeva.homestead.com/files/THROUGH_HOLE_CRACKS-3.jpg Steve -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Lee Whiteman Sent: Wednesday, February 11, 2009 1:42 PM To: [log in to unmask] Subject: Re: [TN] CRACKED ENIG PADS Victor, George, Vladimir, and Company Steve should be attaching the cross-section photograph. Since I did not supervise the cross-sectioning activity, I will not vouch on the quality of the cross-section. I do see a layer (crack?) between the ENIG plating and the copper surface, but the report that I received indicated that there was "no evidence of a lack of bonding" - the lab reports words. That layer (crack?) seems more pronounced than similar ENIG cross-sections I have seen. Lee Whiteman, PMP Senior Member Engineering Staff L-3 Communications East Telephone: (856) 338-3508 FAX: (856) 338-2906 E-Mail: [log in to unmask] -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez Sent: Wednesday, February 11, 2009 2:23 PM To: [log in to unmask] Subject: Re: [TN] CRACKED ENIG PADS Can you share the photos of the cross section? -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Wenger, George M. Sent: Wednesday, February 11, 2009 12:51 PM To: [log in to unmask] Subject: Re: [TN] CRACKED ENIG PADS Lee, When you say "Evidently" that you have done cro Lee, When you say "Evidently" that you have done cross sectioning and see that the cracks are only in the Ni and Au and not in the Cu? Since you said "There was no evidence of a lack of bonding between the copper and the ENIG finish" that implies to me that you did cross section but since I wasn't sure I thought I'd ask. Regards, George George M. Wenger Andrew Wireless Solutions Senior Principal FMA/Reliability Engineer 40 Technology Drive, Warren, NJ 07059 (908) 546-4531 (Office) (732) 309-8964 (cell) [log in to unmask] -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory Sent: Wednesday, February 11, 2009 1:42 PM To: [log in to unmask] Subject: Re: [TN] CRACKED ENIG PADS Hi Lee! Have your pictures posted. They are here: http://stevezeva.homestead.com/files/THROUGH_HOLE_CRACKS-1.jpg http://stevezeva.homestead.com/files/THROUGH_HOLE_CRACKS-2.jpg I have to let those that know more about plating than I do answer this one... Steve -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Lee Whiteman Sent: Wednesday, February 11, 2009 12:20 PM To: [log in to unmask] Subject: [TN] CRACKED ENIG PADS I have asked Steve to put up a pair of pictures I received. They are of cracks within the ENIG finish of a PWB. I know that the board failed, based on IPC-6011 and IPC-6012. My question is what would cause the cracking? Evidently, it is in the Nickel layer and the copper layer was not compromised. There was no evidence of a lack of bonding between the copper and the ENIG finish. These boards are fresh from the supplier. Just curious... Thanks in advance. 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