Mornin' Everbody! Well, here in Tulsa, we're just like a lot of other people in the country this morning, trying to stay warm. Right now we're sitting at -10 C. with a wind chill of -15 C. It's supposed to be colder tomorrow... GA, I have your pictures posted now. They're at: http://stevezeva.homestead.com/files/Fracture1.jpg http://stevezeva.homestead.com/files/Fracture2.jpg Hopefully someone can give you some ideas... Steve ________________________________ From: Tan Geok Ang [mailto:[log in to unmask]] Sent: Wednesday, January 14, 2009 7:27 PM To: [log in to unmask]; Steve Gregory Subject: Possible cause on open Hi Steve, Please help to download these pictures TechNet, thanks. Hi All experts, Testing (combine test of 16G at 85 oC) was performed on evaluation boards with under-filled BGAs. Open issue (cracks) was detected only at some corners of the BGA (35x35mm with 1156 balls) after the test. Lead-free process and PCB with ENIG surface finish. Peak temperature is 248 oC with a 65 sec above 217 oC. FYI, the service lab has not come out a report. What are the possible causes? (CET mismatches, Lead-free alloy related, material, processes) Thank you in advance. Regards GA Tan --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------