We find delamination and crazing on representative test coupons, by means of capacitance changes between flooded planes. You can determine which layer is delaminated and the magnitude but not the X/Y location of the delamination using our method. Testing coupons allows us to rank the propensity for delamination in the board due to assembly and rework. It turns out that both material robustness and construction, specifically grid size, are the major influences in delamination. Baking to remove volatiles usually helps but it can contribute to delamination also when the temperatures and bake times are too aggressive. I am under the impression that ultrasound methods are limited to large grid sizes and low layer counts. I doubt that ultra sound would have the acuity to resolve crazing. Sincerely, Paul Reid Program Coordinator PWB Interconnect Solutions Inc. 235 Stafford Rd., West, Unit 103 Nepean, Ontario Canada, K2H 9C1 613 596 4244 ext. 229 Skype paul_reid_pwb [log in to unmask] <mailto:[log in to unmask]> -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez Sent: Friday, January 02, 2009 9:10 AM To: [log in to unmask] Subject: [TN] PWB Delamination Detection by C-SAM Fellow TechNetters: Searching for supporting information on non destructive analysis with C-SAM to confirm raw board delamination. Victor, --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------