Vladimir, Ditto. Regards, George Vladimir, Ditto. Regards, George George M. Wenger Andrew Wireless Solutions Senior Principal FMA/Reliability Engineer 40 Technology Drive, Warren, NJ 07059 (908) 546-4531 (Office) (732) 309-8964 (cell) [log in to unmask] -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Vladimir Igoshev Sent: Tuesday, January 27, 2009 9:31 AM To: [log in to unmask] Subject: Re: [TN] SnPbAg solder and Immersion Silver PCBs Hi Kevin, The main concern about the presence of Ag in solder joints is "Ag embrittlement". Me personally, I've never seen any signs of it even in the joints of components with a few microns (not microinches!!!!) thick layer of Ag. Now I'm eager to see what Dave Hillman will have to say about it :-) ------Original Message------ From: Kevin Glidden Sender: TechNet To: [log in to unmask] ReplyTo: TechNet E-Mail Forum ReplyTo: Kevin Glidden Sent: Jan 27, 2009 08:35 Subject: [TN] SnPbAg solder and Immersion Silver PCBs Morning all, Question today about SnPbAg solder. We have always used Sn63Pb37 solder alloy for all products, with exception of some high temp solders for special cases. The lion's share of our PCBs are ImAg finish, 5 to 12 micro-inches, per IPC-4553. In reading about SnPbAg solder, it appears to be recommended for use on SMT components with thin (?) silver finishes. This is to prevent the dissolution of the component lead into the solder joint. Drawbacks appear to be only that the joint is not as shiny and reduced mobility of the solder. Is it also considered good practive to use an SnPbAg alloy for immersion silver PCBs for the same reasons? Any tech articles available on this? Thanks (again!) Kevin Glidden Manufacturing Engineer Luminescent Systems Inc. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- SENTEC 11 Canadian Road, Unit 7. Scarborough, ON M1R 5G1 Tel: (416) 899-1882 Fax: (905) 882-8812 www.sentec.ca ------------------------------------------------------------------------------------------------ This message is for the designated recipient only and may contain privileged, proprietary, or otherwise private information. If you have received it in error, please notify the sender immediately and delete the original. Any unauthorized use of this email is prohibited. ------------------------------------------------------------------------------------------------ [mf2] --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------