I've had mixed results, primarily on BGA's. One example had a supplier provided reballed components perfectly. One instance, a supplier reballed the component using a 260C peak temperature, roasting the component. My general rule of thumb is to not reball because the component (BGA) will see at least 2 thermal cycles in its life cycle. The refinishing process has to be closely monitored to assure that the components do not get thermally stressed. Not only do you have to worry about the cost of refinishing the component but also the lead time and the reliability of the component. The warranty of some components become invalid if you refinish the components so check with the component manufacturer on thermal and warranty concerns. I would be concerned about having the new finish come in contact with the component body. But that is a Catch 22. Assuming that you have a tin plated devices, if you don't go to the component body, you're susceptible to tin whiskers. If you do go to the component body, you could be thermally stressing the component. Hope this helps from the frozen tundra of Camden, New Jersey. I think I'll go to the reflow ovens to defrost... Lee Whiteman, PMP Senior Member Engineering Staff L-3 Communications East Telephone: (856) 338-3508 FAX: (856) 338-2906 E-Mail: [log in to unmask] -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke Sent: Monday, January 19, 2009 7:08 PM To: [log in to unmask] Subject: [TN] conversion of leaded parts Hi all, I just had this enquiry on converting leaded parts to lead free. Does anyone have any good experiences or contacts. Sounds like the part is an SOIC. Thanks in advance John Burke (408) 515 4992 John, Would you have a few minutes to talk to me about RoHS? There's one IC in a product that I've developed, which cannot be replaced with a lead-free part. Thus, I cannot sell in Europe. Any ideas? __________ Information from ESET Smart Security, version of virus signature database 3779 (20090119) __________ The message was checked by ESET Smart Security. http://www.eset.com --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------