Morning all, Question today about SnPbAg solder. We have always used Sn63Pb37 solder alloy for all products, with exception of some high temp solders for special cases. The lion's share of our PCBs are ImAg finish, 5 to 12 micro-inches, per IPC-4553. In reading about SnPbAg solder, it appears to be recommended for use on SMT components with thin (?) silver finishes. This is to prevent the dissolution of the component lead into the solder joint. Drawbacks appear to be only that the joint is not as shiny and reduced mobility of the solder. Is it also considered good practive to use an SnPbAg alloy for immersion silver PCBs for the same reasons? Any tech articles available on this? Thanks (again!) Kevin Glidden Manufacturing Engineer Luminescent Systems Inc. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------