Hi Chris, 

 

The normal board thickness tolerance is about +/-.007in. . Typical
solder thickness as paste is about .006 in. nom. If the part floats to
the top of the solder joint it will be something less than .006 or if
the switch leads sink to the copper surface in the molten solder then it
will be flush with the board surface... how much tolerance on the lead
bend? Mounting? Brackets? Front panel? Etc... What if the board warps? I
can see why you are looking for some sort of spec to refer to, however,
there may not be one. I certainly am not aware of one that could help...
perhaps someone else knows of something they could refer you to... but
the only method I know is to fully look at ALL the possibilities and
work through the math. 

 

Best regards,

 

Bill Brooks 

Datron World Communications, Inc.
(760)602-7004 

________________________________

From: DesignerCouncil [mailto:[log in to unmask]] On Behalf Of
[log in to unmask]
Sent: Monday, January 12, 2009 7:19 AM
To: [log in to unmask]
Subject: [DC] solder thickness after reflow for tol. stackup

 


Hello All, 

A mechanical designer is doing a tolerance stackup on one of our layouts
and asked what we allow for the height of the solder between the board
and the part. I babbled a while about how it's not that simple, then
rooted around in IPC specs a while but couldn't find anything more
definitive than "wetting is evident" for a value. I need to get back to
him with a max value of some sort. 

Does anyone out there have a value they plug in for stackup analysis? 

We have SMT push-button switches and need to know where the top of the
button will be relative to the surface of the PCB, min/max. 

Thanks in Advance, 
Chris
 


  

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