Hello, The BGA device was not reworked after initial assembly. For whatever reason, the people who thought they were being slick with their aftermarket heat sink also decided to put way too much thermal compound on the component. There probably is a difference in the corner heights but I do not have the equipment to measure it properly. Thank you, David Tremmel 872 S. Milwaukee Ave, #253 Libertyville, IL 60048 847 557-9574 - Phone 847 557-9573 - Fax http://ValuRecovery.com VALUE RECOVERY Quality is the nature of the service -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez Sent: Monday, December 08, 2008 7:12 AM To: [log in to unmask] Subject: Re: [TN] RE: Xbox360 BGA issue Was the BGA device reworked after initial assembly soldering process? I see unusual flux residue on the carrier surface. Also, a higher mag pics to truly see the two end corner height differences. I do see a reasonable deflection from on end to another. http://stevezeva.homestead.com/files/Xbox_GPU_A.jpg victor, -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory Sent: Monday, December 08, 2008 7:03 AM To: [log in to unmask] Subject: [TN] RE: Xbox360 BGA issue Mornin' David! Got your picture, and I have it posted. It's at: http://stevezeva.homestead.com/files/Xbox_GPU_A.jpg BOY! Them balls are really smooshed! Steve --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------