Hello List, We are considering implementing a 0.80 mm pitch BGA on a development project and I have question about escape vias. The part manufacturer recommends that we use a 0.019" pad with a 0.010" drill. The board has to be a IPC-6012 class 3 PWB and I would like to have a 0.003 annular ring on the escape vias. One of our board vendors suggested we use a epoxy filled via which would relieve us of the annular ring issue but I am not sure about still being a class 3 board. Does anybody know where I can confirm that epoxy filled vias are acceptable in a class 3 board? Thanks, Dave Connitt CID+ Printed Circuit Designer KDI Precision Products, Inc. A Wholly Owned Subsidiary of: L3 Communications 3975 McMann Road Cincinnati, Ohio 45245 Ph. 513- 943-2010 Fax 513-943-2288 --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------