Hi, I just received the 'Final Draft of the C-revision for PC-4101, Specification for Base Materials for Rigid and Multilayer Printed Boards. I am rather disappointed to find that the STII-concept has not been included in this draft. I was promised that the concept would get serious consideration and be included in the C-revision 'if appropriate'. Over 2 years have passed since I withdrew my NEGATIVE on the B-revision of this document to expedite its timely publication, even though flawed. From what I can tell from the meeting minutes absolutely nothing has been done by the committee regardng the inclusion of the STII-concept into IPC-4101C. The STII-concept has found favorable interest by users both in the USA and Europe, with some interest expressed in Asia as well. Its effectiveness is clearly evident, it does not take anything away from any of the materials, it makes selection for suitability much easier, and it combines the impact of the major parameters affecting PCB survival/reliability. Given the impact of the high LF-soldering temperatures on the survivability and reliability of PCBs, and given the fact that more and more people are actually going LF-free, it is important that designers are given all appropriate and necessary tools. As this draft stands, I will vote NEGATIVE. However, if I am a single voice in the wilderness, the committee might be tempted to again postpone addressing the issues. I therefore urge you send appropriately worded comments to the people below: [log in to unmask] [log in to unmask] [log in to unmask] [log in to unmask] Regards, Werner Engelmaier Engelmaier Associates, L.C. Electronic Packaging, Interconnection and Reliability Consulting 7 Jasmine Run Ormond Beach, FL 32174 USA Phone: 386-437-8747, Cell: 386-316-5904 E-mail: [log in to unmask], Website: www.engelmaier.com --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------