Thanks Richard! Interesting article indeed. Regards, Amol S. Kane Process Engineer Harvard Custom Manufacturing PCBA Division AS9100B and ISO9001:2000 Certified [log in to unmask] Web: www.harvardgrp.com Phone: 607-687-7669 Ext. 349 Fax: 607-687-9733 -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke Sent: Monday, November 24, 2008 11:15 AM To: [log in to unmask] Subject: Re: [TN] BGA Re-balling services Richard, I would be interested in the patent publication number of the oxygen evacuation process. With so much inert gas use in the industry both for general soldering as well as re-work - Nitrogen for reflow, flourinert for vapor phase and argon for some processes both blanket and "stream" I would be very interested to see how you did that!! By the way, the article does not mention one of the major advantages of a laser solder joint. The joints cool down from the inside out; as the fastest heat transfer on cool down is by conduction into the substrate whereas a conventional solder joint cools from the outside in as it is cooling by convection - the whole assembly being at or near the same temperature which is not the case with a laser. This means that in general a laser soldered joint of this type as well as having initially finer grain structure due to the faster cool down produced by this method is less prone to any internal voiding issues due to the cooling process. John John Burke (408) 515 4992 -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D. Sent: Monday, November 24, 2008 5:40 AM To: [log in to unmask] Subject: Re: [TN] BGA Re-balling services Amol, I recently developed a "superior" reballing method with a client I work for called Analog Technologies, Inc. I am forwarding your email to them, but in the meantime you can read about it in October's Circuits Assembly magazine. Here is a link to the article, which was the cover story. This is the best method to use, as it does not heat the component during the stripping of the old solder or during the ball attachment process, thus eliminating two thermal cycles. Solder spheres soldered with laser have proven to be much more reliable than those soldered with convection, especially when our patented oxygen evacuation is performed as part of the laser reball process. http://circuitsassembly.com/cms/content/view/7205/128/ -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Kane, Amol (349) Sent: Friday, November 21, 2008 2:22 PM To: [log in to unmask] Subject: Re: [TN] BGA Re-balling services Thanks for your replies! I am located in Upstate NY --Amol From: [log in to unmask] [mailto:[log in to unmask]] Sent: Friday, November 21, 2008 12:39 PM To: Kane, Amol (349) Subject: Re: [TN] BGA Re-balling services Hi Amol - I recommend 4 services: Tintronics in Huntsville Alabama, Six Sigma in San Jose CA, Premier in AZ and Corfin (a facility on the East coast). All four do a good job (they do have their moments, they are human) and are reasonable in cost/schedule. I also recommend you review their procedures/processes to make sure you approve their protocols. Good Luck. Dave "Kane, Amol (349)" <[log in to unmask]> Sent by: TechNet <[log in to unmask]> 11/21/2008 10:06 AM Please respond to TechNet E-Mail Forum <[log in to unmask]>; Please respond to "Kane, Amol (349)" <[log in to unmask]> To [log in to unmask] cc Subject [TN] BGA Re-balling services Dear Technetters, Looking for a reliable BGA-reballing service provider. Any recommendations? Thanks, Amol WARNING: Export Control This document may contain technical data within the definition of the International Traffic in Arms Regulations (ITAR), and subject to the Export Control Laws of the U.S. Government. Transfer of such data by any means to a foreign person, whether in the United States or abroad, without proper export authorization or other approval from the U.S. Department of State is prohibited. CONFIDENTIALITY NOTICE: This e-mail, and any attachments, is for the sole use of the intended recipient(s) and may contain information that is confidential and protected from disclosure under the law. Any unauthorized review, use, disclosure, or distribution is prohibited. If you are not the intended recipient, please contact the sender by reply e-mail, and delete/destroy all copies of the original message and attachments. 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Thank you. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------