Actually they've also changed the vendor. Their initial prototypes were done with another vendor, which had the same thickness control problem. When they switched and started to see the same problem with lot-to-lot, they considered changing to OSP. Do PCB manufacturers have more difficulties with controlling gold thicknesses with thinner boards, like 0.020"-0.030"? Andy Quoting Pete Houwen <[log in to unmask]>: > That's an interesting process. > > The vendor was giving them poor quality product, so they changed the > product. Did they also change the vendor? > > Seems to me there was a better answer than risking your own manufacturing > process when there are plenty of ENiG vendors getting it right, all the time. > > Or maybe I'm just touchy becuase it took me over 6 months to disqualify a > potential vendor who had that very problem, (among many others.) Some > people need a bigger flash to reach that BFO. > > --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------