Actually they've also changed the vendor. Their initial prototypes  
were done with another vendor, which had the same thickness control  
problem. When they switched and started to see the same problem with  
lot-to-lot, they considered changing to OSP.

Do PCB manufacturers have more difficulties with controlling gold  
thicknesses with thinner boards, like 0.020"-0.030"?

Andy

Quoting Pete Houwen <[log in to unmask]>:

> That's an interesting process.
>
> The vendor was giving them poor quality product, so they changed the
> product.   Did they also change the vendor?
>
> Seems to me there was a better answer than risking your own manufacturing
> process when there are plenty of ENiG vendors getting it right, all the time.
>
> Or maybe I'm just touchy becuase it took me over 6 months to disqualify a
> potential vendor who had that very problem, (among many others.)  Some
> people need a bigger flash to reach that BFO.
>
>

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