Thanks for the table. -------------- Original message -------------- From: "Jeremias, Michael" <[log in to unmask]> > This table seems very valuable. > Pete , can You add additional information? > > Which board thicknesses are investigated? > Which finishes are investigated? > > I attach the information of the SMTA-Paper, reporting some investigations on > OSP-finish : > > IMPROVING HOLE-FILL IN LEAD-FREE SOLDERING OF THICK PRINTED CIRCUIT BOARDS WITH > OSP FINISH > Sanmina-SCI Corporation (LF2) > from SMTA Conference 2008, Orlando, Florida, August 17 -21, 2008 > > > They told that they had a big rejection rate with OSP finish, where gap is > less than 11,5 mils. This leads to different values to Your table?. > > Sincerly > > Michael Jeremias > Industrial Engineering (OPPI41) > Electronics Production > ((( Defence Electronics > EADS Deutschland GmbH > 89077 Ulm > Tel.: +49 (0) 7 31.3 92-5533 > Fax: +49 (0) 7 31.3 92-73 15 > E-Fax: +49 (0) 7 31.3 92-20 5533 > > mailto: [log in to unmask] > EADS Deutschland GmbH > Registered Office: Ottobrunn > District Court of Munich HRB 107 648 > Chairman of the Supervisory Board: Dr. Thomas Enders > Managing Directors: Dr. Stefan Zoller (chairman), Michael Hecht > This E-mail and any attachment(s) to it are for the addressee's use only. > It is strictly confidential and may contain legally privileged information. No > confidentiality or privilege is waived or lost by any mistransmission. > If you are not the intended addressee, then please delete it from your system > and notify the sender immediateley. You are hereby notified that any use, > disclosure, copying or any action taken in reliance on it is strictly prohibited > and may be unlawful. - Thank you. > > > > -----Ursprüngliche Nachricht----- > Von: TechNet [mailto:[log in to unmask]] Im Auftrag von Pete Houwen > Gesendet: Mittwoch, 29. Oktober 2008 14:07 > An: [log in to unmask] > Betreff: Re: [TN] How to improve solder filling and wetting contact angles for > thermal vias at wave soldering process. > > We did some testing of design parameters when we switched to lead-free, and > found that the lead-hole ratio is more critical. We also found that top side > pad size is irrelevant for hole fill, but large bottom side pads can adversly > affect hole fill. Using this chart, we are able to achieve 75% with regularity > (and we do not have the best process controls in our plant): > > Lead Range Pad Size Hole Size > .000-.017 0.05 0.026 > .018-.022 0.06 0.035 > .023-.027 0.07 0.04 > .028-.032 0.07 0.046 > .033-.042 0.08 0.052 > .043-.052 0.09 0.062 > .053-.063 0.1 0.073 > .064-.076 0.11 0.086 > .077-.086 0.12 0.096 > .087-.106 0.14 0.116 > .107-.115 0.15 0.125 > (dimensions in inches) > > standard plane connects are thermal relief, using (4) .008" spokes. > > This testing was done only to establish design parameters, there are plenty of > process parameters that will affect hole fill. But if your design parameters > aren't good, all the process tweaks in the world won't fix trhe problem. > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 15.0 To > unsubscribe, send a message to [log in to unmask] with following text in the BODY > (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) > delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or > (MAIL) To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest Search the archives of previous posts at: > http://listserv.ipc.org/archives Please visit IPC web site > http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or > contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 > ----------------------------------------------------- > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 15.0 > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for > additional information, or contact Keach Sasamori at [log in to unmask] or > 847-615-7100 ext.2815 > ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------