Question for the TechNet gurus. The spec in the subject says that solder touching the component body is a defect. But it states that it is allowed for SOTs. We use a component in a TSFP (thin small flat package). The configuration like a 3 lead sot, but the leads are not gullwing - they come straight out of the device and the whole package mounts flat onto the board. It is much smaller than a SOT, on the order of ~1.2mm sq in total area. Does this fit in the definition of a SOT? The recommended layout actually has the pads start under the device body. I'm not sure how you could possibly avoid solder touching the body. In general, why is it a defect for solder to touch the component body for other component types? Thanks so much for your help. Genny --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------