Hi Pete, This is a research/development project. The vias are currently tented, plus some are under a couple of 100 pin QFP's. I would have to move the vias out from under the FPGA's or risk solder balls once I untented them. Since this is a development project, I doubt they will spin the board again unless there is some other issue. We rarely wave solder boards anymore as there are very few thru hole parts on them anymore. The wave was a great way to fill vias with solder. Ah, the good old days.. Dave Connitt CID+ Printed Circuit Designer KDI Precision Products, Inc. A Wholly Owned Subsidiary of: L3 Communications 3975 McMann Road Cincinnati, Ohio 45245 Ph. 513- 943-2010 Fax 513-943-2288 -----Original Message----- From: Pete Houwen [mailto:[log in to unmask]] Sent: Thursday, October 16, 2008 9:36 AM To: [log in to unmask]; Connitt, Dave @ KDI Subject: Re: Problems with plating vias closed Is this just a matter of closing the holes? Rather than having your PCB supplier try to plate the holes full, can you let them (partially) fill during soldering? --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------