Arnaud I have not seen any definitive side by side data comparing the reliability of ENIG and flash gold. Perhaps a vendor in Asia could make this comparison. I have worked with OEMs using both coatings, but from different suppliers. Flash gold was found to be a better choice (fewer quality issues). Process control is operating the process in a manner consistent with the suppliers specification. When I audit a shop I request a copy of the chemical suppliers specification for each bath. In cases, I have found that the PCB supplier did not have these instructions. In other cases the process was not being operated according to the suppliers specification. In the case of ENIG this can cause porous gold or even black pad. Unfortunately, auditing incoming product is a must to maintained a high quality product. The auditing frequency should be a function of the product's complexity and the OEMs long term experience with the PCB supplier. Initially the frequency should be 100%. As confidence in the supplier increases, the frequency can usually be reduced. Best regards Lee JLP Consultants LLC 804 779 3389 ----- Original Message ----- From: "arnaud grivon" <[log in to unmask]> To: "TechNet E-Mail Forum" <[log in to unmask]>; "Lee parker" <[log in to unmask]> Sent: Thursday, October 02, 2008 5:05 AM Subject: Re: [TN] Electrolytic (Flash) Nickel Gold Finish Lee, Could you elaborate on the kind of 'serious' problems we can have with Al wedge wire bonding + flash Au plating? What effects are you referring to and what shall be controlled in the Au process? I have had one case where usual controls including pull tests were not sufficient to detect a 'serious' problem due to the flash Au finish. I would echo Inge and say that ENIG is safer. Arnaud Grivon Lee parker a écrit : > Anand > > Flash gold plating is widely available in Asia and is being used as a > alternative to ENIG. This has been in place since early 2000s. The > thickness > is about 2 micro inches. I have worked with several OEMs using this > coating > for aluminum wire bonding and the results have been positive. Of course, > if > the process is not properly controlled, you may have serious problems. I > always recommend continuing due diligence and incoming inspection with any > supplier. > > Best regards > Lee > JLP Consultants LLC > 804 779 3389 > > > ----- Original Message ----- > From: "Anand" <[log in to unmask]> > To: <[log in to unmask]> > Sent: Wednesday, October 01, 2008 5:02 PM > Subject: [TN] Electrolytic (Flash) Nickel Gold Finish > > > Hi All, > > I want to use Alluminum WEDGE wire bonding for COB. > as the ENIG is suitable only for Gold Wire Bonding .....! which i don't > want. > > I thought about Electrolytic (Flash) Nickel Gold Finish. as alluminum wire > bond > can be used. > > but i don;t know the recommended thickness of nickel and Gold for > > A) Electrolytic ?????? I didn't found any ipc std for this ? > > B) Can any ONE please guide me for the thickness of this plating....! > > C) again as there is no phosphurus used in electrlytic process how can we > prevent the corrosion for this plating ? > > thanks and eagerly waiting for the answer on above three questions ..... > > > > Regards, > Anand > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 15.0 > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 > for additional information, or contact Keach Sasamori at [log in to unmask] or > 847-615-7100 ext.2815 > ----------------------------------------------------- > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 15.0 > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 > for additional information, or contact Keach Sasamori at [log in to unmask] or > 847-615-7100 ext.2815 > ----------------------------------------------------- > --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------