I'm sorry to say, but your whole sentence sounds confusing. What so you mean by saying "easy to fail"? Any benchmarks? How do you know what the failure path is - any cross-sections/SEM/EDS have been done? How they failed (off the line/from field and so on. Regards, Vladimir -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Min Jun Sent: Thursday, September 18, 2008 9:51 PM To: [log in to unmask] Subject: [TN] 基鹸: [TN] Copper BGA balls Hi all and Engelmaier, How do you think about the reliability of the cooper pin, like TI's DSSMT or Tyco's CPSB.We found the solder jointer type easy to fail, especially for lager package with few solder ball. The failure mode is brittle fracture between Nickel layer and IMC layer. PLS refer to focus.ti.com.cn/cn/lit/an/slyt212/slyt212.pdf www.autosplice.com/us/autosplice/Images/SolderballAppNotes.pdf Min Jun H3C process engineer Tel:+86-010-82774234 **************************************************************************** *********** This e-mail and its attachments contain confidential information from H3C, which is intended only for the person or entity whose address is listed above. Any use of the information contained herein in any way (including, but not limited to, total or partial disclosure, reproduction, or dissemination) by persons other than the intended recipient(s) is prohibited. If you receive this e-mail in error, please notify the sender by phone or email immediately and delete it! **************************************************************************** ************ -----喨周圻周----- 窟周繁: TechNet [mailto:[log in to unmask]] 旗燕 Werner Engelmaier /* 窟僕扮寂: 2008定9埖18晩 20:25 辺周繁: [log in to unmask] 麼籾: Re: [TN] Copper BGA balls Hi Reuven, In terms of cost reduction, it depends what you are comparing it to---SnPb soldering, BGA ball replacement, failures, etc. I terms of reliabilty---take a look at my reliability column in GSMT&P magazine of August 2007 Werner Future workshops: Reliability Issues with Lead-Free Soldering Processes, September 22, Schaumburg Failure Mode and Root Cause Analyses Reliability (Fatigue, Brittle Fracture, ENIG), September 22, Schaumburg Solder Joint Reliability: Parts 1 & 4, Oct. 9, Moscow, Russia Solder Joint Reliability: Part 4, Oct. 17, Timisoara, Rumania Solder Joint Reliability: Parts 1 & 4, Oct. 22, Tallinn, Estonia ************** Psssst...Have you heard the news? There's a new fashion blog, plus the latest fall trends and hair styles at StyleList.com. (http://www.stylelist.com/trends?ncid=aolsty00050000000014) --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3. 16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------