j-std-002/003 are regarding the solderability test...95% solder coverage are most quoted by dip and look test but i prefere wetting balance



----- Original Message ----
From: William Yeoh <[log in to unmask]>
To: [log in to unmask]
Sent: Thursday, August 7, 2008 3:53:55 PM
Subject: Re: [TGA] Solder ability test

 
Hi guys,
 
For IPC, after solder ability
test, how do we define whether the PCB is meeting the requirement? Which
documents to refer to?
 
I have some photo below,
perhaps you can advise whether this is meeting spec or not.
 
 
Thank you!
Best Regards,
William Yeoh