j-std-002/003 are regarding the solderability test...95% solder coverage are most quoted by dip and look test but i prefere wetting balance ----- Original Message ---- From: William Yeoh <[log in to unmask]> To: [log in to unmask] Sent: Thursday, August 7, 2008 3:53:55 PM Subject: Re: [TGA] Solder ability test Hi guys, For IPC, after solder ability test, how do we define whether the PCB is meeting the requirement? Which documents to refer to? I have some photo below, perhaps you can advise whether this is meeting spec or not. Thank you! Best Regards, William Yeoh