I posted a link to that article on this forum last week. Thank you for writing that, Herr Engelmaier. It has been very helpful, at least for me. For those of you who missed it: http://www.globalsmt.net/regions/japan/content/view/33/65/ -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier /* Sent: Thursday, August 07, 2008 1:12 PM To: [log in to unmask] Subject: Re: [TN] No-Flow Underfill CTE Hi Ben, Indeed you should be. Work by Burnette and co-workers at Motorola has clealry shown that the best combination of properties for the underfill are CTEs~26 ppm/C and modulus of 5.5 GPa-further you want a snap-cure underfill not a slow curing one. I explained all of this in my reliability column in Global SMT & Packaging magazine [Engelmaier, W., "Reliability Improvement with Underfill," Global SMT & Packaging, Vol. 6, No. 3, March 2006, pp. 66-67.] Werner Future workshops: Reliability Issues with Lead-Free Soldering Processes, September 22, Schaumburg Failure Mode and Root Cause Analyses Reliability (Fatigue, Brittle Fracture, ENIG), September 22, Schaumburg Solder Joint Reliability: Parts 1 & 4, Oct. 9, Moscow, Russia Solder Joint Reliability: Part 4, Oct. 17, Timisoara, Rumania Solder Joint Reliability: Parts 1 & 4, Oct. 22, Tallinn, Estonia ************** Looking for a car that's sporty, fun and fits in your budget? Read reviews on AOL Autos. (http://autos.aol.com/cars-BMW-128-2008/expert-review?ncid=aolaut0005000 0000017 ) --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------