Technetters, Can anyone offer advice on using a no-flow underfill (fluxing underfill or epoxy flux) on a circuit card assembly? I thought underfill was supposed to have a CTE that was close to a compromise between the other CTEs of the assembly (solder, PWB, component) but it seems that all the no-flow underfills have CTEs (55-75 ppm/°C) that are higher than all the other assembly materials. Should I not be worried about this amount of mismatch? Thanks in advance, Ben --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------