A selective wave carrier with a top hat, or as has been said a selective soldering machine. Rex Waygood Technical Manager PartnerTech Poole Ltd Benson Road Poole Dorset BH17 0RY United Kingdom Tel: +44 (0)1202 674333 Fax: +44 (0)1202 678028 DDI: +44 (0)1202 338222 Mob: +44 (0)7887 997403 [log in to unmask] www.PartnerTech.co.uk -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Chris Schaefer Sent: 05 August 2008 00:16 To: [log in to unmask] Subject: [TN] Liquid Masking Deposition Process Hello all, Just like many of you out there I am in the position of putting much labor into a non-value add process such as applying liquid mask to protect areas of a board from being soldered. I'm sure someone within these walls has come up with a good economical solution to this problem. This may be in the form of a 'cheap conveyorized robotic application system; an inline curing system; possibly a UV masking material to reduce cure time while still maintain cured integrity of the material; etc... The problem for us is that we need to apply masking as a bare board and after components are loaded. The bare board to protect locations from being soldered and the loaded board to hold down components during flow soldering. This very manual process is highly variable and comsumes much time, thus the reason to look for ways to improve this process. At the same time reduce labor and increase repeatability, it would be also very beneficial to reduce the amount of soils placed in our aqueous washers that would be perfect. Not asking for much. Thanks in advance. Any help welcomed and appreciated. Chris --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- ------------------------------------------------------------------------------- The information contained within this e-mail and any attachments contained therein may be confidential and/or legally privileged and is for the use of the intended recipient only. If you are not the intended recipient please delete it from your system and notify the sender by return e-mail. The content of this e-mail may not be copied or disclosed to any third parties without prior permission from the sender. E-mail is susceptible to data corruption, interception, tampering and viruses. We do not accept any liability for any such incidents or any consequences thereof. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------