Hello all, Just like many of you out there I am in the position of putting much labor into a non-value add process such as applying liquid mask to protect areas of a board from being soldered. I'm sure someone within these walls has come up with a good economical solution to this problem. This may be in the form of a 'cheap conveyorized robotic application system; an inline curing system; possibly a UV masking material to reduce cure time while still maintain cured integrity of the material; etc... The problem for us is that we need to apply masking as a bare board and after components are loaded. The bare board to protect locations from being soldered and the loaded board to hold down components during flow soldering. This very manual process is highly variable and comsumes much time, thus the reason to look for ways to improve this process. At the same time reduce labor and increase repeatability, it would be also very beneficial to reduce the amount of soils placed in our aqueous washers that would be perfect. Not asking for much. Thanks in advance. Any help welcomed and appreciated. Chris --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------