Some more details thanks for the input 1. BGA component information. A) Component Type Plastic BGA B) Ball pitch is 50 mil,31.5 mil C) Ball diameter,24 mil,12.0 mil D) Solder Ball alloy composition Leaded Sn/Tn----- 63/37 E) Ball count 841,144 F) Package Size,U14 37.5 mmX 37.5 mm,13mm X 13mm 2. PCB fabrication, A) PCB finish, HASL Finish B) Pad size, 24 mil,,12.5 mil C) Pad shape, circular D) Pad design is SMDP 3. Stencil fabrication methodology. (Laser cut or E-Fab),Stencil is laser cut with electro polishing B) Aperture size,24 mil,16 mil D) Aperture shape, Circular E) Solder volume, We measure solders paste height . Average paste height 5 mil 4. Oven Profile A) Ramp-up, 0 to 3 degree/sec B) Soak time, 60 to 90 sec C) Soak Temp.130 to 160 degree C D) Peak temp,210 to 230 degree C E) TAL time,30 to 90 sec F) Cool Down.0 t0 3 degree/sec G) Soft copy of reflow profile. Please refer the attached file for reflow profile as well as for BGA data sheet. 5. X-Ray images,Please refer the attached file for X ray images. John -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier /* Sent: 16 August 2008 19:43 To: [log in to unmask] Subject: Re: [TN] BGA reballing Hi john, You are skimpy on the details. What solder prior and after reballing? What cause the failure? Failure mode? Mechanism? Whats causing the shorts? Where? Werner Future workshops: Reliability Issues with Lead-Free Soldering Processes, September 22, Schaumburg Failure Mode and Root Cause Analyses Reliability (Fatigue, Brittle Fracture, ENIG), September 22, Schaumburg Solder Joint Reliability: Parts 1 & 4, Oct. 9, Moscow, Russia Solder Joint Reliability: Part 4, Oct. 17, Timisoara, Rumania Solder Joint Reliability: Parts 1 & 4, Oct. 22, Tallinn, Estonia ************** Looking for a car that's sporty, fun and fits in your budget? Read reviews on AOL Autos. (http://autos.aol.com/cars-Volkswagen-Jetta-2009/expert-review?ncid=aolaut00 030000000007 ) --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------